Sn64.7/Bi35Ag0.3 SMD Welding Paste 183°C Melting Point Lead-free Syringe No Clean Solder Paste For Phone Component Repair (MN-013 50g)
$19.85
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$19.85
Price when purchased online
Free shipping
Free 30-day returns
Sold and shipped by eurcenter.net
Free 30-day returns Details
Product details
| Management number | 218783677 | Release Date | 2026/05/03 | List Price | $7.94 | Model Number | 218783677 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Lead-Free Solder Paste Content: Alloy Tin 64.7% Bi35% Ag0.3%, Solder Flux Content: 10.5%
- Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
- Paste Features: Lead-Free, No Clean, Strong Viscosity, Bright Welding Point
- Paste Features: Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point: 183°C,Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, SpecialWelding Of Small Components.
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance
| Item Weight | 2.08 ounces |
|---|---|
| Manufacturer | SoPagre |
| Power Source | NK |
| Item model number | MN-013 50g |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 6.81 x 4.06 x 1.14 inches |
| Included Components | 1 Set Solder Paste |
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