5 Bottle 25K Leaded BGA Soldering Balls, Reball Reballing Tin Ball Sn63% Pb37% (25000pcs/bottle) for GPU CPU IC Chip Soldering Rework
Product details
| Management number | 218079903 | Release Date | 2026/05/03 | List Price | $10.80 | Model Number | 218079903 | ||
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| Category | |||||||||
Material: Tin Sn63% Pb37%; 25,000pcs per bottle; 0.4mm 0.45mm 0.5mm 0.6mm 0.76mm Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic.
- High Quality: 5 Bottle BGA Solder Balls 25k/bottle for soldering rework, durable material for a long time use, widely applicable to all kinds of electronic products.
- Very Useful: These tin balls are used for connection of semiconductor chip, circuit module and PCB board, helpful for your soldering work.
- Diameter: 0.4mm 0.45mm 0.5mm 0.6mm 0.76mm
- Solder Ball Alloy: Sn63% Pb37%
- Temperature: When soldering, please make sure that if for Lead-Free chips is 245℃--260℃ (Maximum); for Leaded chips is 180℃--205℃ (Maximum)
| Material | lead |
|---|---|
| Item Weight | 5.3 ounces |
| Part Number | W2 |
| Manufacturer | QWIN |
| Power Source | hand_powered |
| Item model number | W2 |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 4.17 x 3.35 x 1.06 inches |
| Included Components | SOLDER BALLS |
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